Resin composition, resin molded article, and method of preparing resin composition
US9562154B1 · kind B1 · utility
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20Claims
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Key dates
| Filing date | Jan 15, 2016 |
| Grant date | Feb 7, 2017 |
| Priority date | — |
| Expiry date | Jan 15, 2036 |
Classification
- Technology area (CPC C)Chemistry; Metallurgy
- CPC primaryC08L2207/04
- WIPO fieldMacromolecular chemistry, polymers
- WIPO sectorChemistry
Abstract
A resin composition including a thermoplastic resin, a glass fiber, a resin which is different from the thermoplastic resin and contains at least one of an amide bond and an imide bond, and a compatibilizer, wherein a part of the resin which is different from the thermoplastic resin and contains at least one of an amide bond and an imide bond forms a domain having a diameter of from 5 μm to 10 μm in a matrix of the thermoplastic resin.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.