Sulfonamide based polymers for copper electroplating
US9562300B2 · kind B2 · utility
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2Claims
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Key dates
| Filing date | Dec 28, 2015 |
| Grant date | Feb 7, 2017 |
| Priority date | — |
| Expiry date | Dec 28, 2035 |
Classification
- Technology area (CPC C)Chemistry; Metallurgy
- CPC primaryC25D3/60
- WIPO fieldSurface technology, coating
- WIPO sectorChemistry
Abstract
Sulfonamide based polymers are reaction products of sulfonamides and epoxides. The polymers may be used as levelers in copper electroplating baths, to provide good throwing power. Such reaction products may plate copper or copper alloys with good surface properties and good physical reliability.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.