Opto-electronic semiconductor module and method for the production thereof
US9564555B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Aug 11, 2008 |
| Grant date | Feb 7, 2017 |
| Priority date | — |
| Expiry date | May 9, 2031 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH10H20/856
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
An optoelectronic semiconductor module includes a chip carrier, a light emitting semiconductor chip mounted on the chip carrier and a cover element with an at least partly light transmissive cover plate, which is arranged on the side of the semiconductor chip facing away from the chip carrier, and has a frame part, wherein the frame part laterally encloses the semiconductor chip, is joined to the cover plate in a joining-layer free fashion and is joined to the chip carrier on its side remote from the cover plate.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.