Optoelectronic component and method for the production thereof
US9564566B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Aug 5, 2014 |
| Grant date | Feb 7, 2017 |
| Priority date | — |
| Expiry date | Aug 5, 2034 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH10H20/0364
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
An optoelectronic component includes a housing having an electrically conductive first contact section, and an optoelectronic semiconductor chip arranged on the first contact section, wherein the optoelectronic semiconductor chip and the first contact section are at least partly covered by a first layer including a silicone, a second layer including SiO2 is arranged at a surface of the first layer, the second layer has a thickness of 10 nm to 1 μm, and a third layer is arranged above the second layer.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.