Flexible LED device with wire bond free die
US9564568B2 · kind B2 · utility
0Cited by
20References
23Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Sep 21, 2015 |
| Grant date | Feb 7, 2017 |
| Priority date | — |
| Expiry date | Sep 21, 2035 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH10H20/858
- WIPO fieldAudio-visual technology
- WIPO sectorElectrical engineering
Abstract
An article includes a flexible polymeric dielectric layer having first and second major surfaces. The first major surface has a conductive layer thereon and at least one cavity therein. The at least one cavity contains a conductive material including electrically separated first and second portions supporting and electrically connecting a light emitting semiconductor device to the conductive layer on the first major surface.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.