Lightweight cavity filter structure
US9564672B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Mar 21, 2012 |
| Grant date | Feb 7, 2017 |
| Priority date | — |
| Expiry date | Mar 16, 2033 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01Q9/0407
- WIPO fieldSurface technology, coating
- WIPO sectorChemistry
Abstract
Embodiments provide a novel fabrication method and structure for reducing structural weight in radio frequency cavity filters and novel filter structure. The novel filter structure is fabricated by electroplating the required structure over a mold. The electrodeposited composite layer may be formed by several layers of metal or metal alloys with compensating thermal expansion coefficients. The first or the top layer is a high conductivity material or compound such as silver having a thickness of several times the skin-depth at the intended frequency of operation. The top layer provides the vital low loss performance and high Q-factor required for such filter structures while the subsequent compound layers provide the mechanical strength.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.