Center flex single side polishing head having recess and cap
US9566687B2 · kind B2 · utility
2Cited by
11References
22Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Oct 13, 2014 |
| Grant date | Feb 14, 2017 |
| Priority date | — |
| Expiry date | Nov 21, 2034 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L21/67092
- WIPO fieldMachine tools
- WIPO sectorMechanical engineering
Abstract
A polishing head assembly for single side polishing of silicon wafers is provided. The polishing head assembly includes a polishing head and a cap. The polishing head has a recess along a bottom portion, the recess having a recessed surface. The cap is positioned within the recess, and has an annular wall and a floor extending across the annular wall. The floor is spaced from the recessed surface to form a chamber therebetween. The chamber is configured to be pressurized for deflecting the floor. The annular wall is attached to the polishing head with an adhesive.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.