Semiconductor device and method for fabricating the same
US9567208B1 · kind B1 · utility
9Cited by
2References
19Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Nov 6, 2015 |
| Grant date | Feb 14, 2017 |
| Priority date | — |
| Expiry date | Nov 6, 2035 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2224/11
- WIPO fieldMicro-structural and nano-technology
- WIPO sectorChemistry
Abstract
A semiconductor structure includes a first device, a second device, a first hole, a second hole, and a sealing object. The second device is contacted to the first device, wherein a chamber is formed between the first device and the second device. The first hole is disposed in the second device and defined between a first end with a first circumference and a second end with a second circumference. The second hole is disposed in the second device and aligned to the first hole. The sealing object seals the second hole. The first end links with the chamber, and the first circumference is different from the second circumference.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.