Tungsten chemical-mechanical polishing composition
US9567491B2 · kind B2 · utility
4Cited by
12References
41Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Jun 25, 2015 |
| Grant date | Feb 14, 2017 |
| Priority date | — |
| Expiry date | Jun 25, 2035 |
Classification
- Technology area (CPC C)Chemistry; Metallurgy
- CPC primaryC09K13/00
- WIPO fieldBasic materials chemistry
- WIPO sectorChemistry
Abstract
A chemical-mechanical polishing composition includes colloidal silica abrasive particles having a chemical compound incorporated therein. The chemical compound may include a nitrogen-containing compound such as an aminosilane or a phosphorus-containing compound. Methods for employing such compositions include applying the composition to a semiconductor substrate to remove at least a portion of a layer.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.