Manifold assembly
US9568138B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Jun 30, 2014 |
| Grant date | Feb 14, 2017 |
| Priority date | — |
| Expiry date | Feb 3, 2035 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T137/85938
- WIPO fieldMechanical elements
- WIPO sectorMechanical engineering
Abstract
According to one aspect, a manifold assembly includes a skid, a low pressure manifold connected to the skid, and a high pressure manifold connected to the skid. In another aspect, the high pressure manifold has a modular configuration so that the high pressure manifold is disconnectable in whole or in part from the skid, and reconnectable in whole or in part to the skid. In yet another aspect, the high pressure manifold includes high pressure modules, all of which are in fluid communication with each other and each of which is adapted to be in fluid communication with at least one pump. In still yet another aspect, the low pressure manifold includes one or more flow lines, the high pressure manifold includes fittings, and the manifold assembly includes vibration isolators to dampen dynamic loading, the vibration isolators being disposed between the fittings and the one or more flow lines.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.