Apparatus, method and system for a modular light-emitting diode circuit assembly
US9568154B2 · kind B2 · utility
Assignee
Inventor
Key dates
| Filing date | Oct 17, 2013 |
| Grant date | Feb 14, 2017 |
| Priority date | — |
| Expiry date | Jun 5, 2034 |
Classification
- Technology area (CPC F)Mechanical Engineering; Lighting; Heating
- CPC primaryF21Y2115/10
- WIPO fieldElectrical machinery, apparatus, energy
- WIPO sectorElectrical engineering
Abstract
Provided herein is an improved apparatus, method and system for providing a modular LED circuit assembly. Specifically, examples of the present invention include a modular LED circuit which may be scaled and used in a wide variety of form factors. One example of the present invention may provide an apparatus for supporting a light-emitting diode which includes an LED circuit board including a first major surface and a second major surface. The first major surface may include a first contact pad and a second contact pad, where each of the first contact pad and the second contact pad are configured to receive a respective connector from the LED. The second major surface of the LED circuit board may include a first area, a second area, and a third area, where a substrate is attached to the LED circuit board across the third area.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.