Heat-conductive connection arrangement
US9568259B2 · kind B2 · utility
2Cited by
8References
8Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Sep 30, 2014 |
| Grant date | Feb 14, 2017 |
| Priority date | — |
| Expiry date | Sep 30, 2034 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH05K1/0206
- WIPO fieldAudio-visual technology
- WIPO sectorElectrical engineering
Abstract
A heat-conductive connection arrangement for connecting a printed circuit board to a cooling body. The connection arrangement has a carrier which is flat. At least part of the carrier includes at least one balloon body which faces away from the carrier and is connected to the carrier. The balloon body includes an envelope which encloses an interior, and the interior is at least in part filled with a preferably free-flowing, in particular viscous, heat-conducting substance. The envelope is configured so as to tear open under the influence of pressure and to thus release the heat-conducting substance.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.