Memory controller placement in a three-dimensional (3D) integrated circuit (IC) (3DIC) employing distributed through-silicon-via (TSV) farms

US9569380B2 · kind B2 · utility

Assignee

• QUALCOMM Incorporated · US

Inventors

• Sung Kyu Lim · Duluth, US
• Karamvir CHATHA · San Diego, US
• Yang Du · Carlsbad, US
• Kambiz Samadi · San Diego, US

Key dates

• Filing date: Jan 22, 2015
• Grant date: Feb 14, 2017
• Expiry date: Mar 15, 2035

Classification

• Technology area (CPC —): General

Abstract

Aspects disclosed in the detailed description include memory controller placement in a three-dimensional (3D) integrated circuit (IC) (3DIC) employing distributed through-silicon-via (TSV) farms. In this regard, in one aspect, a memory controller is disposed in a 3DIC based on a centralized memory controller placement scheme within the distributed TSV farm. The memory controller can be placed at a geometric center within multiple TSV farms to provide an approximately equal wire-length between the memory controller and each of the multiple TSV farms. In another aspect, multiple memory controllers are provided in a 3DIC based on a distributed memory controller placement scheme, in which each of the multiple memory controllers is placed adjacent to a respective TSV farm among the multiple TSV farms. By disposing the memory controller(s) based on the centralized memory controller placement scheme and/or the distributed memory controller placement scheme in the 3DIC, latency of memory access requests is minimized.