Semiconductor device leadframe
US9570323B2 · kind B2 · utility
0Cited by
2References
19Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Sep 4, 2014 |
| Grant date | Feb 14, 2017 |
| Priority date | — |
| Expiry date | Sep 4, 2034 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH03F2200/451
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
For so called film assisted moulding (FAM) device processing techniques there is provided lead frame for a semiconductor device, comprising a base portion and a connection lead, said base portion arranged for mounting a semiconductor die, said connection lead comprising a horizontal portion for external connection and an angled portion for connection to said semiconductor die, wherein the angled portion has a positive angle with respect to the base portion. The connection lead may comprise a recessed portion.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.