Interconnect structure

US9570389B1 · kind B1 · utility

Assignee

• International Business Machines Corporation · US

Inventors

• Dinesh A. Badami · South Burlington, US
• Baozhen Li · South Bend, US
• Wen Liu · Beijing, CN
• Chih-Chao Yang · Glenmont, US

Key dates

• Filing date: Oct 27, 2015
• Grant date: Feb 14, 2017
• Expiry date: Oct 27, 2035

Classification

• Technology area (CPC H): Electricity
• CPC primary: H01L23/53238
• WIPO field: Semiconductors
• WIPO sector: Electrical engineering

Abstract

An interconnect structure includes a dielectric layer with one or more trenches extending therein, one or more interconnect lines, and one or more first liner layers. Each interconnect line is positioned within a trench. At least one first liner layer is affixed between the trench bottom surface and the interconnect bottom surface. The interconnect structure further includes one or more second liner layers. At least one of the second liner layers is affixed directly to the interconnect top surface and at least one interconnect side surface. The interconnect structure further includes at least one air gap. Each air gap is positioned between the trench side surface and the interconnect side surface. A corresponding method of manufacture and product of a method of manufacture are also disclosed.