Chip packaging method and chip package using hydrophobic surface
US9570415B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Apr 24, 2015 |
| Grant date | Feb 14, 2017 |
| Priority date | — |
| Expiry date | Apr 24, 2035 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2924/014
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
A chip packaging method using a hydrophobic surface includes forming superhydrophobic surfaces forming hydrophilic surfaces on predetermined positions of the superhydrophobic surfaces formed on the one of a first chip or the first board and the one of a second chip or a second board, respectively, generating liquid metal balls on the hydrophilic surfaces formed on the one of the first chip or the first board and the one of the second chip or the second board, respectively, and packaging the one of the first chip or the first board and the one of the second chip or the second board by combing the liquid metal ball of the one of the first chip or the first board and the liquid metal ball of the one of the second chip or the second board with each other.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.