Semiconductor device
US9570446B1 · kind B1 · utility
3Cited by
5References
9Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Dec 18, 2015 |
| Grant date | Feb 14, 2017 |
| Priority date | — |
| Expiry date | Dec 18, 2035 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2924/1434
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
A semiconductor device includes a plurality of semiconductor devices, a plurality of metal lines electrically connected to at least one of the semiconductor devices, and a protective layer on the metal lines. The protective layer includes a plurality of open areas partially exposing the metal lines and which serves as pads. A first pad includes a first area that extends from at least one of the metal lines and at least one second area around and separated from the first area.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.