Method of encapsulating an optoelectronic device and light-emitting diode chip

US9570662B2 · kind B2 · utility

Assignee

• OSRAM Opto Semiconductors GmbH · DE

Inventors

• Sebastian Taeger · Bad Abbach, DE
• Michael Huber · Bad Abbach, DE
• Martin Welzel · Dresden, DE
• Karl Engl · Niedergebraching, DE

Key dates

• Filing date: Jul 10, 2012
• Grant date: Feb 14, 2017
• Expiry date: Jul 10, 2032

Classification

• Technology area (CPC H): Electricity
• CPC primary: H10H20/0362

Abstract

A method of encapsulating an optoelectronic device includes providing a surface intended to be encapsulated, the surface containing platinum, generating reactive oxygen groups and/or reactive hydroxyl groups on the surface, and depositing a passivation layer by atomic layer deposition on the surface.