Printed wiring board
US9572246B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Feb 27, 2015 |
| Grant date | Feb 14, 2017 |
| Priority date | — |
| Expiry date | Feb 27, 2035 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH05K2201/10356
- WIPO fieldElectrical machinery, apparatus, energy
- WIPO sectorElectrical engineering
Abstract
A printed wiring board comprises a pattern layer, an insulating layer and a ground layer laminated in an upper-lower direction. The printed wiring board is formed with one or more vias. The insulating layer is provided between the pattern layer and the ground layer. The ground layer is formed with a ground pattern. The pattern layer is formed with one common ground plane and two or more pads. The pads are arranged in a lateral direction. The common ground plane is located forward of the pads in the front-rear direction. The vias include a first via that connects the common ground plane and the ground pattern with each other. The pads include one or more ground pads and one or more signal pads. The ground pads are connected with the common ground plane. The signal pads are unconnected with the common ground plane.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.