Sensor element
US9574912B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Oct 14, 2014 |
| Grant date | Feb 21, 2017 |
| Priority date | — |
| Expiry date | Oct 14, 2034 |
Classification
- Technology area (CPC B)Performing Operations; Transporting
- CPC primaryB81B7/0077
- WIPO fieldMeasurement
- WIPO sectorInstruments
Abstract
A sensor element may include a measuring element and a functional housing at least partially surrounding the measuring element including a plastic molded housing. The measuring element may include a hot plate mounted on a carrier substrate by means of narrow arms in a broadly thermally decoupled manner. The carrier substrate may be provided with contacts leading to the measuring element and terminating in contact/bonding points on the carrier substrate. The carrier substrate together with the contact/bonding points may be at least partially integrated into the plastic molded housing, leaving the hot plate exposed. The housing may include connection wiring for the contact/bonding points.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.