Patent · US Active

Sensor element

US9574912B2 · kind B2 · utility

0Cited by
5References
7Claims
0Family size

Assignee

Inventors

Key dates

Filing dateOct 14, 2014
Grant dateFeb 21, 2017
Priority date
Expiry dateOct 14, 2034

Classification

  • Technology area (CPC B)Performing Operations; Transporting
  • CPC primaryB81B7/0077
  • WIPO fieldMeasurement
  • WIPO sectorInstruments

Abstract

A sensor element may include a measuring element and a functional housing at least partially surrounding the measuring element including a plastic molded housing. The measuring element may include a hot plate mounted on a carrier substrate by means of narrow arms in a broadly thermally decoupled manner. The carrier substrate may be provided with contacts leading to the measuring element and terminating in contact/bonding points on the carrier substrate. The carrier substrate together with the contact/bonding points may be at least partially integrated into the plastic molded housing, leaving the hot plate exposed. The housing may include connection wiring for the contact/bonding points.

Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.