Positive microcontact printing

US9575226B2 · kind B2 · utility

Assignee

• The Chinese University of Hong Kong · CN

Inventors

• Shih-Chi Chen · Hong Kong, CN
• Ni Zhao · Longbeilingcun, CN
• Huihua Xu · Hong Kong, CN
• Xi Zhou · Plano, US

Key dates

• Filing date: Sep 22, 2014
• Grant date: Feb 21, 2017
• Expiry date: Feb 13, 2035

Classification

• Technology area (CPC H): Electricity
• CPC primary: H05K2203/122
• WIPO field: Surface technology, coating
• WIPO sector: Chemistry

Abstract

A process for positive microcontact printing, including inking a patterned mold with a thiol; contacting the mold with a metal surface of a substrate; backfilling the metal surface with a solution containing an aromatic amine to form a backfilling layer; etching the metal surface of the substrate; and rinsing the substrate to remove the backfilling layer.