Devices for methodologies related to wafer carriers
US9576838B2 · kind B2 · utility
2Cited by
23References
20Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Sep 16, 2015 |
| Grant date | Feb 21, 2017 |
| Priority date | — |
| Expiry date | Sep 16, 2035 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T428/219
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
Disclosed are systems, devices and methodologies for handling wafers in wafer processing operations through use of wafer carriers. In an example situation, a wafer carrier can be configured as a plate to allow bonding of a wafer thereto to provide support for the wafer during some processing operations. Upon completion of such operations, the processed wafer can be separated from the support plate so as to allow further processing. Various devices and methodologies related to such wafer carriers for efficient handling of wafers are disclosed.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.