Method of forming thin film and method of manufacturing organic light-emitting display device
US9577193B2 · kind B2 · utility
Assignee
Inventor
Key dates
| Filing date | Oct 7, 2015 |
| Grant date | Feb 21, 2017 |
| Priority date | — |
| Expiry date | Oct 7, 2035 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH10K59/1201
- WIPO fieldOptics
- WIPO sectorInstruments
Abstract
A method of forming a thin film, the method including: disposing a resist portion on a substrate, the resist portion including: a first region including a first upper surface; and a second region including a second upper surface, the first upper surface disposed higher than the second upper surface and forming a step; disposing a first protection layer covering the resist portion; exposing the first upper surface; removing the first region; disposing a first thin film on the substrate; disposing a second protection layer covering the first thin film; exposing the second upper surface; removing the second region; disposing a second thin film on the substrate; and removing the first protection layer and the second protection layer.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.