Patent · US Active

Wireless interconnect for an integrated circuit

US9577322B2 · kind B2 · utility

0Cited by

2References

18Claims

0Family size

Assignee

NXP B.V. · NL

Inventor

Romano Hoofman · Leuven, BE

Key dates

Filing date	Oct 20, 2009
Grant date	Feb 21, 2017
Priority date	—
Expiry date	Jan 4, 2032

Classification

Technology area (CPC H)Electricity
CPC primaryH01L2924/0002
WIPO fieldTelecommunications
WIPO sectorElectrical engineering

Abstract

A wireless interconnect for an integrated circuit and a method of making the wireless interconnect. The interconnect includes a first antenna and a second antenna arranged over a plurality of electrically conductive interconnects. The interconnect also includes a propagation layer. The first and second antennae are arranged in between the propagation layer and the electrically conductive interconnects.

Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.