Moving image sensor package
US9578217B2 · kind B2 · utility
23Cited by
1References
19Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Apr 21, 2015 |
| Grant date | Feb 21, 2017 |
| Priority date | — |
| Expiry date | May 31, 2035 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T29/4913
- WIPO fieldAudio-visual technology
- WIPO sectorElectrical engineering
Abstract
A moving image sensor package is provided that may be used to provide optical image stabilization (OIS) in the same form factor as non-OIS enabled image sensors utilized in portable/mobile devices. The moving image sensor package includes an image sensor attached to a MEMS actuator mounted within a cutout in a circuit board, wherein the MEMS actuator has substantially the same thickness as the circuit board.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.