Backplane module and method of manufacturing same
US9578771B2 · kind B2 · utility
0Cited by
8References
18Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Jan 30, 2015 |
| Grant date | Feb 21, 2017 |
| Priority date | — |
| Expiry date | Feb 4, 2035 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH05K2203/0126
- WIPO fieldAudio-visual technology
- WIPO sectorElectrical engineering
Abstract
A method of manufacturing a backplane module includes providing a thermally conductive substrate, and applying a predetermined volume of epoxy extending between a first electrical component disposed on the thermally conductive substrate and a second electrical component disposed on the thermally conductive substrate to create an electrical pathway therebetween.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.