Patent · US Active

Heat dissipating device

US9578780B1 · kind B1 · utility

8Cited by

7References

8Claims

0Family size

Assignee

CHAUN-CHOUNG TECHNOLOGY CORP. · TW

Inventors

Po-Chou Shih · Taipei, TW
Heng-Chi Hsu · Taipei, TW
Tun-Ta Chen · New Taipei, TW

Key dates

Filing date	Oct 16, 2015
Grant date	Feb 21, 2017
Priority date	—
Expiry date	Oct 16, 2035

Classification

Technology area (CPC H)Electricity
CPC primaryH01L23/473
WIPO fieldSemiconductors
WIPO sectorElectrical engineering

Abstract

A heat dissipating device used for a PCB having a heat generating component includes a vapor chamber, a fin set, and a fixture. The vapor chamber is attached to the heat generating component. The fin set is connected above to the vapor chamber. The fixture is fixed to the PCB. The vapor chamber and the fin set are clamped between the fixture and the PCB. The fixture has a press plate which is pressed against a top of the fin set. Therefore, the press plate presses the vapor chamber without direct contact. That is, the applied pressure is concentrated on the fin set and then distributed evenly to the vapor chamber, which prevents deformation of the vapor chamber due to uneven pressure and further achieves the effect of the vapor chamber being attached smoothly to the heat generating component.

Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.