Heat management for electronic enclosures
US9578781B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | May 9, 2014 |
| Grant date | Feb 21, 2017 |
| Priority date | — |
| Expiry date | Oct 13, 2034 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH05K7/20436
- WIPO fieldAudio-visual technology
- WIPO sectorElectrical engineering
Abstract
An enclosure and method for housing electrical components. The enclosure includes walls provided about the electrical components, the walls having poor thermal conductivity. At least one thermal transport device extends through at least one respective wall. The at least one thermal transport device has a first portion which is positioned within the enclosure, a second portion which is positioned outside of the enclosure and a transition portion which connects the first portion to the second portion. The at least one thermal transport device has a high effective thermal conductivity and provides a high thermal conductivity path for heat energy to pass from within the enclosure to outside the enclosure.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.