Heat dissipation device, electronic device, and base station device
US9578782B2 · kind B2 · utility
4Cited by
8References
12Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Mar 26, 2015 |
| Grant date | Feb 21, 2017 |
| Priority date | — |
| Expiry date | Apr 21, 2035 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH05K7/2069
- WIPO fieldAudio-visual technology
- WIPO sectorElectrical engineering
Abstract
A heat dissipation device includes: a first plate with a first surface on which a first heat dissipation fin is formed; a second plate with a first surface on which a second heat dissipation fin is formed, and a heat conduction unit that passes through a first through-hole of the first plate and a second through-hole of the second plate.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.