Miniature multilayer radiative cooling case wtih hidden quick release snaps
US9578783B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Feb 22, 2011 |
| Grant date | Feb 21, 2017 |
| Priority date | — |
| Expiry date | Nov 19, 2032 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH05K13/00
- WIPO fieldAudio-visual technology
- WIPO sectorElectrical engineering
Abstract
A passive cooling arrangement for an electronic housing assembly is provided. The assembly includes a frame disposed in the housing assembly; a circuit board supported in the frame; a heat generating component disposed on the circuit board; and a heat sink configured with a substantially flat peripheral portion and a depression portion. The substantially flat peripheral portion faces and is nearly coextensive with an outer wall of said housing assembly, and the depression portion is in thermal engagement with the heat generating component on the circuit board. The frame includes a base having embosses which support the circuit board in a position enabling thermal engagement of the heat generating component and the depression portion of the heat sink. The outer wall of the housing assembly is preferably unvented and the housing assembly is preferably oriented in use with the outer wall facing upwardly.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.