Computer system with bypass air plenum
US9578786B1 · kind B1 · utility
Assignee
Inventors
Key dates
| Filing date | Jun 10, 2014 |
| Grant date | Feb 21, 2017 |
| Priority date | — |
| Expiry date | Sep 9, 2034 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH05K13/04
- WIPO fieldAudio-visual technology
- WIPO sectorElectrical engineering
Abstract
A rack-mountable computer system enables an airflow that cools components in an upstream portion of the computer system interior to be cooled through mixing with a bypass airflow downstream of the components in the upstream portion. The mixed airflow can cool components in a downstream portion of the interior. The bypass airflow is directed by a bypass plenum that is unencompassed by the separate plenum that directs the airflow to cool the upstream portion components. The bypass plenum can be established by one surface of a component that supports one or more heat-producing components in the separate plenum, including an underside of a circuit board mounted in the interior. Relative flow rates through the separate plenums can be adjusted, via flow control elements, to separately control heat removal from components upstream and downstream of the air mixing, based at least in part upon air temperatures in the separate interior portions.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.