Inverter power module packaging with cold plate
US9578788B2 · kind B2 · utility
18Cited by
3References
19Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Mar 5, 2014 |
| Grant date | Feb 21, 2017 |
| Priority date | — |
| Expiry date | Jan 30, 2035 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2924/0002
- WIPO fieldAudio-visual technology
- WIPO sectorElectrical engineering
Abstract
A heat sink is provided. The heat sink includes a single-piece housing having a floor and two walls, the walls perpendicular to the floor and the walls are parallel to each other. The heat sink includes the housing having an inlet and an outlet. The housing is configured to attach power modules to an outer surface of the floor and to outer surfaces of the two walls. The housing is configured to cool the power modules in response to fluid flow into the inlet.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.