Sensor mounting in an implantable blood pump
US9579436B2 · kind B2 · utility
0Cited by
143References
20Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Aug 30, 2013 |
| Grant date | Feb 28, 2017 |
| Priority date | — |
| Expiry date | Jul 11, 2035 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T29/49128
- WIPO fieldMedical technology
- WIPO sectorInstruments
Abstract
Techniques for mounting a sensor are disclosed. In some implementations, a molded interconnect device carries a sensor for transducing a position of a rotor of the implantable blood pump. The molded interconnect device includes one or more integrated electronic circuit traces configured to electrically connect the Hall sensor with a printed circuit board of the implantable blood pump, and the molded interconnect device is configured to be mounted to the printed circuit board.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.