Method for processing a workpiece and processing device
US9579749B2 · kind B2 · utility
Assignee
Inventor
Key dates
| Filing date | Jan 8, 2014 |
| Grant date | Feb 28, 2017 |
| Priority date | — |
| Expiry date | Dec 27, 2034 |
Classification
- Technology area (CPC B)Performing Operations; Transporting
- CPC primaryB23K26/38
- WIPO fieldMachine tools
- WIPO sectorMechanical engineering
Abstract
A method for processing a workpiece with a processing device which has a processing head which can be moved at a defined speed and distance from a surface of the workpiece, the method comprising at least partially detecting a surface topography of the workpiece to be processed, determining a minimum desired operating distance of the processing head from the workpiece with reference to the detected surface topography of the workpiece and a trailing spacing of the processing head associated with the defined speed, and processing the workpiece with the processing head at the established minimum desired operating distance of the processing head from the workpiece.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.