Composition for polishing purposes, polishing method using same, and method for producing substrate
US9579769B2 · kind B2 · utility
3Cited by
2References
14Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Oct 9, 2012 |
| Grant date | Feb 28, 2017 |
| Priority date | — |
| Expiry date | Oct 9, 2032 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L21/304
- WIPO fieldBasic materials chemistry
- WIPO sectorChemistry
Abstract
Provided is a polishing composition, which comprises abrasive grains, a water-soluble polymer, an aggregation inhibitor and water. The ratio R1/R2 is 1.3 or less, where R1 represents the average particle diameter of the particles present in the polishing composition and R2 represents the average particle diameter of the abrasive grains when the abrasive grains are dispersed in water at the same concentration as that of the abrasive grains in the polishing composition. The polishing composition can be used mainly for polishing the surface of a silicon substrate.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.