Controlling adhesives between substrates and carriers
US9579893B2 · kind B2 · utility
0Cited by
7References
15Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Sep 6, 2016 |
| Grant date | Feb 28, 2017 |
| Priority date | — |
| Expiry date | Sep 6, 2036 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T156/1064
- WIPO fieldTextile and paper machines
- WIPO sectorMechanical engineering
Abstract
Controlling adhesives between substrates and carriers includes forming a depression into a bonding area of a backside surface of a substrate of a print head where the bonding area being formed proximate an ink feed slot formed through the thickness of the substrate from the backside surface to a front side surface; placing an adhesive between the bonding area and a substrate carrier, and moving the substrate and the substrate carrier together such that the adhesive flows into the depression.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.