Vapor deposition mask, and manufacturing method and manufacturing device for organic EL element using vapor deposition mask
US9580791B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Apr 26, 2011 |
| Grant date | Feb 28, 2017 |
| Priority date | — |
| Expiry date | Sep 9, 2033 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH10K71/166
- WIPO fieldSurface technology, coating
- WIPO sectorChemistry
Abstract
A vapor deposition mask (70) includes a first layer (71), a second layer (72) and a third layer (73) in this order. A plurality of first openings (71h), a plurality of second openings (72h) and a plurality of third openings (73h) are formed respectively in the first layer, the second layer and the third layer. The first openings, the second openings and the third openings communicate with each other, thereby constituting mask openings (75). The opening dimension of the second openings is larger than the opening dimension of the first openings and is larger than the opening dimension of the third openings. With this configuration, it is possible to prevent reduction of the opening dimension of the mask openings or clogging of the mask openings due to the vapor deposition particles adhering to the mask openings.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.