Apparatus for performing a plasma chemical vapour deposition process
US9580808B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Dec 14, 2012 |
| Grant date | Feb 28, 2017 |
| Priority date | — |
| Expiry date | Sep 28, 2033 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01J37/32247
- WIPO fieldElectrical machinery, apparatus, energy
- WIPO sectorElectrical engineering
Abstract
The invention relates to an apparatus for performing a plasma chemical vapor deposition process. The apparatus comprises a mainly cylindrical resonator being provided with an outer cylindrical wall enclosing a resonant cavity extending in a circumferential direction around a cylindrical axis. The resonator is further provided with side wall portions bounding the resonant cavity in the cylindrical direction, and with a slit configuration extending in a circumferential direction around the cylindrical axis providing access from the resonant cavity radially inwardly. Further, the slit configuration includes slit sections that are mutually offset in the cylindrical direction.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.