Coating film-removing method for cylindrical substrate and manufacturing method for electrophotographic photosensitive member
US9581920B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Jan 14, 2016 |
| Grant date | Feb 28, 2017 |
| Priority date | — |
| Expiry date | Jan 14, 2036 |
Classification
- Technology area (CPC G)Physics
- CPC primaryG03G5/0503
- WIPO fieldOptics
- WIPO sectorInstruments
Abstract
Provided is coating film-removing method for removing unnecessary coating film on outer peripheral surface of lower side of cylindrical substrate by dip coating, the method comprising: supplying solvent to inside of substrate; causing, through use of outer peripheral surface coating film-removing member configured to remove coating film at portion to be subjected to coating film removal in outer peripheral surface of the substrate, the outer peripheral surface coating film-removing member to abut against region ranging from upper end to lower end of coating film at the portion; and removing, under a state wherein the outer peripheral surface coating film-removing member abuts against the region, the coating film at the portion through rubbing by relatively rotating the substrate and the outer peripheral surface coating film-removing member while supplying the solvent, which is supplied to inside and then flows to lower end of the substrate, to abutting portion.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.