Modeling using thin plate spline technology
US9582615B2 · kind B2 · utility
6Cited by
81References
5Claims
0Family size
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Key dates
| Filing date | Jan 16, 2014 |
| Grant date | Feb 28, 2017 |
| Priority date | — |
| Expiry date | Mar 21, 2035 |
Classification
- Technology area (CPC G)Physics
- CPC primaryG06F30/00
- WIPO fieldComputer technology
- WIPO sectorElectrical engineering
Abstract
A method of modeling may include obtaining an input file defining a first geometry, establishing a control related to the first geometry, adjusting the control, and using a thin plate spline transform to adjust the first geometry to a second geometry based on the control.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.