Chip electronic component and board having the same
US9583251B2 · kind B2 · utility
8Cited by
2References
16Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Apr 14, 2015 |
| Grant date | Feb 28, 2017 |
| Priority date | — |
| Expiry date | Apr 14, 2035 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01F2027/2809
- WIPO fieldElectrical machinery, apparatus, energy
- WIPO sectorElectrical engineering
Abstract
There is provided a chip electronic component including: a magnetic body containing magnetic metal powder particles and a thermosetting resin; an internal coil part embedded in the magnetic body; and a surface protection layer with which a surface of the magnetic body is coated. The surface protection layer may prevent a plating spreading phenomenon occurring on a surface of the chip electronic component at the time of forming external electrodes.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.