Patent · US Active

System and method for dual-region singulation

US9583406B2 · kind B2 · utility

0Cited by

0References

33Claims

0Family size

Assignee

Infineon Technologies Austria AG · AT

Inventors

Andrew Christopher Graeme Wood · St. Jakob im Rosental, AT
Gernot Fasching · Premstätten, AT
Marius Aurel Bodea · Villach, AT
Thomas Ostermann · Velden am Wörther See, AT
Erwin Bacher · Villach, AT

Key dates

Filing date	Mar 17, 2015
Grant date	Feb 28, 2017
Priority date	—
Expiry date	Apr 6, 2035

Classification

Technology area (CPC H)Electricity
CPC primaryH01L2924/146
WIPO fieldSemiconductors
WIPO sectorElectrical engineering

Abstract

A method for semiconductor fabrication includes forming a first array of semiconductor circuitry and a second array of semiconductor circuitry separated by a singulation region and a contact region. The method also includes forming a first array of process control monitoring structures within the singulation region of a substrate. The method also includes forming a first array of contact pads disposed in the contact region. The method also includes forming electrical connections between the first array of process control monitoring structures and the first array of contact pads, wherein all external electrical connections to the first array of process control monitoring structures are made through the first array of contact pads.

Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.