Bottom-emitting substrate, display device and manufacturing method of substrate

US9583646B2 · kind B2 · utility

Assignee

• BOE Technology Group Co., Ltd. · CN

Inventors

• Shi Shu · Beijing, CN
• Jingxia Gu · Beijing, CN
• Xiangchun Kong · Beijing, CN
• Feng Zhang · 南丰镇, CN
• Guanbao Hui · Beijing, CN

Key dates

• Filing date: Jun 5, 2014
• Grant date: Feb 28, 2017
• Expiry date: Jul 21, 2034

Classification

• Technology area (CPC H): Electricity
• CPC primary: H10K59/8792

Abstract

A bottom-emitting substrate, a display device and a method for manufacturing the bottom emitting substrate are provided. The bottom-emitting substrate comprises: a base substrate (1); a black matrix layer (2) with a plurality of opening regions and a plurality of non-opening regions disposed on the base substrate (1); and an array substrate unit disposed on the black matrix layer (2), projections of metal layers in the array substrate unit on the black matrix layer (2) locating within the plurality of non-opening regions of the black matrix layer (2). A method for manufacturing the bottom-emitting substrate and a display device comprising the bottom-emitting substrate are also provided.