LED package
US9583689B2 · kind B2 · utility
Assignees
Inventors
Key dates
| Filing date | Jul 10, 2014 |
| Grant date | Feb 28, 2017 |
| Priority date | — |
| Expiry date | Jul 10, 2034 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH10H20/882
- WIPO fieldElectrical machinery, apparatus, energy
- WIPO sectorElectrical engineering
Abstract
An LED package includes a chip carrier, an adhesive layer, one high-voltage LED die, and an encapsulating member. The chip carrier defines a receiving space. The adhesive layer is disposed in the receiving space and has a thermal conductivity of larger than or equal to 1 W/mK. The high-voltage LED die is attached to the adhesive layer to be received in the reflective space and has a top surface formed with a trench. The trench of the high-voltage LED die is disposed at an optical center of the receiving space. The encapsulating member encapsulates the high-voltage LED die and includes a plurality of diffusers. The trench is embedded with the encapsulating member and has a width ranging from 1 μm to 10 μm and a depth of less than or equal to 50 μm.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.