Optoelectronic component, contact-making device, and optoelectronic subassembly

US9583740B2 · kind B2 · utility

Assignee

• Osram OLED GMBH · DE

Inventors

• Joerg Farrnbacher · Regensburg, DE
• Simon Schicktanz · Regensburg, DE

Key dates

• Filing date: Oct 16, 2014
• Grant date: Feb 28, 2017
• Expiry date: Oct 16, 2034

Classification

• Technology area (CPC H): Electricity
• CPC primary: H01L2924/12044
• WIPO field: Semiconductors
• WIPO sector: Electrical engineering

Abstract

An optoelectronic component include a carrier body, an optoelectronic layer structure formed above the carrier body and having at least one contact region for contacting the optoelectronic layer structure, a covering body arranged above the optoelectronic layer structure, at least one contact cutout extending through the covering body and/or the carrier body. The contact cutout has a first and a second cutout regions, which lead into one another and which extend from an outer surface of the covering body and/or of the carrier body in a layer plane direction where the contact region is formed. A first clear width of the contact cutout near the corresponding outer surface in the first cutout region is greater than a second clear width in the second cutout region near the corresponding outer surface. The second clear width is less than a third clear width of the second cutout region near the contact region.