Method and apparatus for adhesion of inserts
US9586363B2 · kind B2 · utility
6Cited by
51References
20Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Oct 3, 2014 |
| Grant date | Mar 7, 2017 |
| Priority date | — |
| Expiry date | Apr 9, 2035 |
Classification
- Technology area (CPC F)Mechanical Engineering; Lighting; Heating
- CPC primaryF16B11/006
- WIPO fieldSurface technology, coating
- WIPO sectorChemistry
Abstract
The present invention contemplates a method for the attachment of a component to a honeycomb structure comprising forming a cavity in the honeycomb structure whereby the cavity is formed within one or more honeycomb cells; placing an insert adapted to enable the attachment of the component to the honeycomb structure whereby a reformable epoxy resin adhesive is injected about the insert or an expandable reformable epoxy resin adhesive is overmolded onto the insert; heating the reformable epoxy resin adhesive; and hardening and adhering the reformable epoxy resin adhesive to one or more interior walls of the cavity upon cooling.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.