Method for continuously producing flexible copper clad laminates
US9587318B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | May 10, 2011 |
| Grant date | Mar 7, 2017 |
| Priority date | — |
| Expiry date | Nov 17, 2031 |
Classification
- Technology area (CPC C)Chemistry; Metallurgy
- CPC primaryC25D5/34
- WIPO fieldSurface technology, coating
- WIPO sectorChemistry
Abstract
Method for continuously producing flexible copper clad laminates includes performing continuous ion implantation and/or plasma deposition on the surface of an organic macromolecular polymer film, and performing continuous copper plating. The bonding force between the copper film and the substrate in a two-layer flexible copper clad laminate produced by the method is much larger than that in a flexible copper clad laminate produced by a sputtering/plating method and equivalent to that in a flexible copper clad laminate produced by a coating method and a lamination method. Meanwhile the thickness of the copper film can be easily controlled to be less than 18 microns.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.