Probe card assembly for testing electronic devices
US9588139B2 · kind B2 · utility
6Cited by
5References
31Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | May 5, 2014 |
| Grant date | Mar 7, 2017 |
| Priority date | — |
| Expiry date | Aug 29, 2034 |
Classification
- Technology area (CPC G)Physics
- CPC primaryG01R1/36
- WIPO fieldMeasurement
- WIPO sectorInstruments
Abstract
A probe card assembly can comprise a guide plate comprising probe guides for holding probes in predetermined positions. The probe card assembly can also comprise a wiring structure attached to the guide plate so that connection tips of the probes are positioned against and attached to contacts on the wiring structure. The attachment of the guide plate to the wiring structure can allow the wiring structure to expand or contract at a greater rate than the guide plate. The probes can include compliant elements that fail upon high electrical current and thermal stresses located away from the contact tips.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.