Patent · US Active

Hot-wire method for depositing semiconductor material on a substrate and device for performing the method

US9589794B2 · kind B2 · utility

1Cited by

2References

15Claims

0Family size

Assignee

Forschungszentrum Jülich GmbH · DE

Inventors

Friedhelm Finger · Emmelshausen, DE
Andreas Schmalen · Nideggen, DE
Johannes Wolff · Eschweiler, DE

Key dates

Filing date	Mar 30, 2012
Grant date	Mar 7, 2017
Priority date	—
Expiry date	Feb 6, 2034

Classification

Technology area (CPC H)Electricity
CPC primaryH01L21/02532
WIPO fieldSurface technology, coating
WIPO sectorChemistry

Abstract

A hot wire device and method for depositing semiconductor material onto a substrate in a deposition chamber in which the ends of at least two filaments are clamped into a filament holder and heated by supplying current, wherein a voltage for generating an electrical current is applied in temporal succession to filaments made of differing materials so that a number of differing semiconductors corresponding to the number of consecutively heated filament materials can be consecutively deposited onto the substrate without opening the chamber.

Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.