Semiconductor IC packaging methods and structures
US9589815B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Nov 7, 2013 |
| Grant date | Mar 7, 2017 |
| Priority date | — |
| Expiry date | Nov 7, 2033 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2224/94
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
An IC packaging method is provided. The method includes providing a semiconductor substrate. The semiconductor substrate has a metal pad and an insulating layer and the insulating layer has an opening to expose the meal pad. The method also includes forming an under-the-ball meal electrode on the exposed metal pad. The under-the-ball metal electrode has an electrode body and an electrode tail, the electrode body is located at a bottom portion of the under-the-ball metal electrode and is in contact with the metal pad, and the electrode tail is located at a top portion of the under-the-ball meal electrode. Further, the method includes forming a solder ball on the under-the-ball metal electrode.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.